Intel Showcases New Chip Packaging Powers.

Packaging has perhaps never been a hotter subject in popular discourse. Since Moore’s Law no longer seems to provide the impact it once did, another path to better computing is ...

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IBM Sees Magnetic Tapes As Mainstream Data Storage Media In Next Decade.

Although the total volume of data is expected to grow exponentially from proliferating technologies such as 5G, IoT, and ...

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Tiny Alveo U50 Accelerator Card Makes a Big Splash.

Last week was an exciting one at Xilinx with the

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Xilinx ML Suite Adds “Award-Winning” to its Name.

By Dale Hitt, Director of Strategic Market Development at Xilinx

We are honored that

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Breaking the Memory Wall In AI.

In the long unfolding arc of technology innovation, artificial intelligence (AI) looms as immense. In its quest to mimic human behavior, the technology touches energy, agriculture, manu...

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Why can’t the Semiconductor Industry afford to take its Eyes off SerDes?.

In this era of pervasive connectivity, everything needs to communicate with each other and everything around them by means of the internet. There is never-ending demand for advanced integrated comm...

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Semiconductor OEMs Experience Spending Declines Worldwide.

Softening market conditions and rising uncertainty in global trade and economy have impacted semiconductor spending from the world’s top OEMs, currently facing the steepest decline in...

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Does Your Memory Stack Up? Xilinx Adds 16 GB High-Bandwidth Memory FPGAs.

When you think of processing performance, storage is not the first thing that comes to mind. But, if you’re handling massive a...

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Integrating Ultra-Thin Si Dies Within A Flexible Label.

Recent developments in the integration of ultra-thin silicon dies within a flexible film lead to a new paradigm. Indeed, thanks to the thinness and flexibility of devices, it is conceivable that fu...

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Integrating Ultra-Thin Si Dies Within A Flexible Label – Shin-Etsu MicroSi.

Recent developments in the integration of ultra-thin silicon dies within a flexible film lead to a new paradigm. Indeed, thanks to the thinness and flexibility of devices, it is conceivable that fu...

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Live! XDF Xclusive News.

Victor’s keynote kickoff

Our 3rd annual Xilinx Developer F...